The fabrication and indentation of cubic silicon carbide diaphragm for acoustic sensing
In this study, 550 nm thick cubic silicon carbide square diaphragms were back etched from Si substrate. Then, indentation was carried out to samples with varying dimensions, indentation lo-cations, and loads. The influence of three parameters is documented by analyzing load-displacement curves. It w...
| الحاوية / القاعدة: | Micromachines |
|---|---|
| المؤلف الرئيسي: | |
| التنسيق: | مقال |
| اللغة: | English |
| منشور في: |
MDPI
2021
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| الوصول للمادة أونلاين: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85115058464&doi=10.3390%2fmi12091101&partnerID=40&md5=abdb413365d7c88bcdb05f9f7102bb1a |