Low-Pressure, Thermal Direct Bonding of PMMA-Dry Film Photoresist-PMMA for Microdevice Fabrication

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Low-Pressure, Thermal Direct Bonding of PMMA-Dry Film Photoresist-PMMA for Microdevice Fabrication

In many microfluidic device fabrications, obtaining the hermetic sealing is a great challenge, especially for bonding between non-homogenous material pairs. This work presents the evaluations of non-homogeneous material bonding between dry film photoresist (DFR) and poly-methyl methacrylate (PMMA) s...

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Bibliographic Details
Published in:	INTELLIGENT MANUFACTURING AND MECHATRONICS, SIMM 2023
Main Authors:	Yazid, Muhamad Fitri M.; Nawang, Farah M.; Nasir, S. Mohd Firdaus S. A.; Yusof, Azmi M.
Format:	Proceedings Paper
Language:	English
Published:	SPRINGER-VERLAG SINGAPORE PTE LTD 2024
Subjects:	Engineering
Online Access:	https://www-webofscience-com.uitm.idm.oclc.org/wos/woscc/full-record/WOS:001313737300035

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