Low-Pressure, Thermal Direct Bonding of PMMA-Dry Film Photoresist-PMMA for Microdevice Fabrication
In many microfluidic device fabrications, obtaining the hermetic sealing is a great challenge, especially for bonding between non-homogenous material pairs. This work presents the evaluations of non-homogeneous material bonding between dry film photoresist (DFR) and poly-methyl methacrylate (PMMA) s...
| Published in: | INTELLIGENT MANUFACTURING AND MECHATRONICS, SIMM 2023 |
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| Main Authors: | , , , , |
| Format: | Proceedings Paper |
| Language: | English |
| Published: |
SPRINGER-VERLAG SINGAPORE PTE LTD
2024
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| Subjects: | |
| Online Access: | https://www-webofscience-com.uitm.idm.oclc.org/wos/woscc/full-record/WOS:001313737300035 |