Optimization of Design Parameters using Taguchi Method for Thermal Stress Analysis in a 3D IC
Thermal stress and deformation analysis plays an important role in understanding the effects of heat on the performance and reliability of a 3D integrated circuit (IC) design. The demand for smaller and powerful electronic devices, 3D IC design gained prominence due to their superior integration cap...
| 出版年: | 2024 IEEE 14TH SYMPOSIUM ON COMPUTER APPLICATIONS & INDUSTRIAL ELECTRONICS, ISCAIE 2024 |
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| 主要な著者: | , , , , , , |
| フォーマット: | Proceedings Paper |
| 言語: | English |
| 出版事項: |
IEEE
2024
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| 主題: | |
| オンライン･アクセス: | https://www-webofscience-com.uitm.idm.oclc.org/wos/woscc/full-record/WOS:001283898700088 |