Optimization of Design Parameters using Taguchi Method for Thermal Stress Analysis in a 3D IC

Optimization of Design Parameters using Taguchi Method for Thermal Stress Analysis in a 3D IC

Thermal stress and deformation analysis plays an important role in understanding the effects of heat on the performance and reliability of a 3D integrated circuit (IC) design. The demand for smaller and powerful electronic devices, 3D IC design gained prominence due to their superior integration cap...

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Bibliographic Details
Published in:2024 IEEE 14TH SYMPOSIUM ON COMPUTER APPLICATIONS & INDUSTRIAL ELECTRONICS, ISCAIE 2024
Main Authors: Bin Sazali, Syamil; Hassan, Hasliza Binti; Yusof, Norliana; Husaini, Yusnira; Aziz, Anees Binti Abdul; Yaakub, Tuan Norjihan Binti Tuan
Format: Proceedings Paper
Language:English
Published: IEEE 2024
Subjects:
Computer Science; Engineering
Online Access:https://www-webofscience-com.uitm.idm.oclc.org/wos/woscc/full-record/WOS:001283898700088

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https://www-webofscience-com.uitm.idm.oclc.org/wos/woscc/full-record/WOS:001283898700088

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