Analytical Modeling of Depletion-Mode MOSHEMT Device for High- Temperature Applications

An analytical model for depletion-mode MOSHEMTs for high-temperature applications is compared against the experimental GaN HEMT data of the AlGaN/GaN MOSHEMT for temperature dependence of 2DEG simulated at 75 degree celsius and 125 degree celsius. Both temperatures reduce the 2DEG density by 4 % in...

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Published in:IEEE ACCESS
Main Authors: Islam, Naeemul; Packeer Mohamed, Mohamed Fauzi; Ahmad, Norhawati; Isa, Muammar Mohamad; Rahim, Alhan Farhanah Abd; Ahmeda, Khaled
Format: Article
Language:English
Published: IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC 2024
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Online Access:https://www-webofscience-com.uitm.idm.oclc.org/wos/woscc/full-record/WOS:001184763900001
author Islam
Naeemul; Packeer Mohamed
Mohamed Fauzi; Ahmad
Norhawati; Isa
Muammar Mohamad; Rahim
Alhan Farhanah Abd; Ahmeda
Khaled
spellingShingle Islam
Naeemul; Packeer Mohamed
Mohamed Fauzi; Ahmad
Norhawati; Isa
Muammar Mohamad; Rahim
Alhan Farhanah Abd; Ahmeda
Khaled
Analytical Modeling of Depletion-Mode MOSHEMT Device for High- Temperature Applications
Computer Science; Engineering; Telecommunications
author_facet Islam
Naeemul; Packeer Mohamed
Mohamed Fauzi; Ahmad
Norhawati; Isa
Muammar Mohamad; Rahim
Alhan Farhanah Abd; Ahmeda
Khaled
author_sort Islam
spelling Islam, Naeemul; Packeer Mohamed, Mohamed Fauzi; Ahmad, Norhawati; Isa, Muammar Mohamad; Rahim, Alhan Farhanah Abd; Ahmeda, Khaled
Analytical Modeling of Depletion-Mode MOSHEMT Device for High- Temperature Applications
IEEE ACCESS
English
Article
An analytical model for depletion-mode MOSHEMTs for high-temperature applications is compared against the experimental GaN HEMT data of the AlGaN/GaN MOSHEMT for temperature dependence of 2DEG simulated at 75 degree celsius and 125 degree celsius. Both temperatures reduce the 2DEG density by 4 % in the GaN HEMT and 3 % in the AlGaN/GaN MOSHEMT. The cause of this diminishing effect is determined to be the decrease of the conduction band offset at high temperatures. Additionally, the device performance degrades at high temperatures due to the immature behaviour of GaN material when it operates at high-power dissipation with poor thermal conductivity. The simulated AlGaN/GaN MOSHEMT performance is comparatively improved compared to the experimental AlGaN/GaN HEMT devices. This improvement could be used to understand the nature of the 2DEG density vs the temperature, hence could enhance the experimental performance of the AlGaN/GaN MOSHEMT.
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
2169-3536

2024
12

10.1109/ACCESS.2024.3373790
Computer Science; Engineering; Telecommunications
gold
WOS:001184763900001
https://www-webofscience-com.uitm.idm.oclc.org/wos/woscc/full-record/WOS:001184763900001
title Analytical Modeling of Depletion-Mode MOSHEMT Device for High- Temperature Applications
title_short Analytical Modeling of Depletion-Mode MOSHEMT Device for High- Temperature Applications
title_full Analytical Modeling of Depletion-Mode MOSHEMT Device for High- Temperature Applications
title_fullStr Analytical Modeling of Depletion-Mode MOSHEMT Device for High- Temperature Applications
title_full_unstemmed Analytical Modeling of Depletion-Mode MOSHEMT Device for High- Temperature Applications
title_sort Analytical Modeling of Depletion-Mode MOSHEMT Device for High- Temperature Applications
container_title IEEE ACCESS
language English
format Article
description An analytical model for depletion-mode MOSHEMTs for high-temperature applications is compared against the experimental GaN HEMT data of the AlGaN/GaN MOSHEMT for temperature dependence of 2DEG simulated at 75 degree celsius and 125 degree celsius. Both temperatures reduce the 2DEG density by 4 % in the GaN HEMT and 3 % in the AlGaN/GaN MOSHEMT. The cause of this diminishing effect is determined to be the decrease of the conduction band offset at high temperatures. Additionally, the device performance degrades at high temperatures due to the immature behaviour of GaN material when it operates at high-power dissipation with poor thermal conductivity. The simulated AlGaN/GaN MOSHEMT performance is comparatively improved compared to the experimental AlGaN/GaN HEMT devices. This improvement could be used to understand the nature of the 2DEG density vs the temperature, hence could enhance the experimental performance of the AlGaN/GaN MOSHEMT.
publisher IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
issn 2169-3536

publishDate 2024
container_volume 12
container_issue
doi_str_mv 10.1109/ACCESS.2024.3373790
topic Computer Science; Engineering; Telecommunications
topic_facet Computer Science; Engineering; Telecommunications
accesstype gold
id WOS:001184763900001
url https://www-webofscience-com.uitm.idm.oclc.org/wos/woscc/full-record/WOS:001184763900001
record_format wos
collection Web of Science (WoS)
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