Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn-Zn lead-free solder

The growth kinetics of Cu5Zn8 phase has been investigated under long-term thermal exposure conditions using single shear lap joints. The Cu5Zn8 phase was formed by reacting Sn-Zn and Sn-Zn-Bi lead-free solders with Cu substrate. A scanning electron microscope (SEM) was used to observe the morphology...

وصف كامل

التفاصيل البيبلوغرافية
الحاوية / القاعدة:Intermetallics
المؤلف الرئيسي: 2-s2.0-77349084832
التنسيق: مقال
اللغة:English
منشور في: 2010
الوصول للمادة أونلاين:https://www.scopus.com/inward/record.uri?eid=2-s2.0-77349084832&doi=10.1016%2fj.intermet.2009.11.016&partnerID=40&md5=b5fe8deb577b498569ede8870e1eb411

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