A chip X-ray image bubble defect detection model combined with Dual-Former attention mechanism

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A chip X-ray image bubble defect detection model combined with Dual-Former attention mechanism

Bubble defects in chip packaging can have an impact on the stability and reliability of the chip. Existing defect detection methods exhibit limited performance in identifying small-sized bubble defects and are highly susceptible to low contrast and noise in chip X-ray images, leading to missed and f...

書誌詳細
出版年:	Measurement: Journal of the International Measurement Confederation
第一著者:	Li A.; Hamzah R.; Rahim S.K.N.A.
フォーマット:	論文
言語:	English
出版事項:	Elsevier B.V. 2025
オンライン･アクセス:	https://www.scopus.com/inward/record.uri?eid=2-s2.0-85216873779&doi=10.1016%2fj.measurement.2025.116871&partnerID=40&md5=6675c1b67553df6fe12fb993d0a8b966

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