Low-Pressure, Thermal Direct Bonding of PMMA-Dry Film Photoresist-PMMA for Microdevice Fabrication

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Low-Pressure, Thermal Direct Bonding of PMMA-Dry Film Photoresist-PMMA for Microdevice Fabrication

In many microfluidic device fabrications, obtaining the hermetic sealing is a great challenge, especially for bonding between non-homogenous material pairs. This work presents the evaluations of non-homogeneous material bonding between dry film photoresist (DFR) and poly-methyl methacrylate (PMMA) s...

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Bibliographic Details
Published in:	Lecture Notes in Mechanical Engineering
Main Author:	Yazid M.F.M.; Nawang F.M.; Nasir S.M.F.S.A.; Yusof A.M.
Format:	Conference paper
Language:	English
Published:	Springer Science and Business Media Deutschland GmbH 2024
Online Access:	https://www.scopus.com/inward/record.uri?eid=2-s2.0-85201525627&doi=10.1007%2f978-981-97-0169-8_35&partnerID=40&md5=7c12182e8fc136dbb65f9f6f2eb01add

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