Low-Pressure, Thermal Direct Bonding of PMMA-Dry Film Photoresist-PMMA for Microdevice Fabrication
In many microfluidic device fabrications, obtaining the hermetic sealing is a great challenge, especially for bonding between non-homogenous material pairs. This work presents the evaluations of non-homogeneous material bonding between dry film photoresist (DFR) and poly-methyl methacrylate (PMMA) s...
| Published in: | Lecture Notes in Mechanical Engineering |
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| Main Author: | |
| Format: | Conference paper |
| Language: | English |
| Published: |
Springer Science and Business Media Deutschland GmbH
2024
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| Online Access: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85201525627&doi=10.1007%2f978-981-97-0169-8_35&partnerID=40&md5=7c12182e8fc136dbb65f9f6f2eb01add |