Prediction of the 96.5Sn-3.0Ag-0.5Cu Stress–Strain Curves Using Artificial Neural Network

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Prediction of the 96.5Sn-3.0Ag-0.5Cu Stress–Strain Curves Using Artificial Neural Network

Approximately 70% of electronics package failures occurred due to solder joint failure. Thus, the strength of the solder joint becomes essential in determining the solder joint’s life. Stress–strain curves from various aging conditions, temperatures, and strain rates are necessary to predict the non...

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Bibliographic Details
Published in:	Lecture Notes in Mechanical Engineering
Main Author:	Yamin A.F.M.; Mahmud J.; Abdullah A.S.; Manan N.F.A.
Format:	Conference paper
Language:	English
Published:	Springer Science and Business Media Deutschland GmbH 2024
Online Access:	https://www.scopus.com/inward/record.uri?eid=2-s2.0-85196639362&doi=10.1007%2f978-981-97-0106-3_58&partnerID=40&md5=4b8cebc77aae4ea3fc1af2cfd01a1777

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