Prediction of the 96.5Sn-3.0Ag-0.5Cu Stress–Strain Curves Using Artificial Neural Network
Approximately 70% of electronics package failures occurred due to solder joint failure. Thus, the strength of the solder joint becomes essential in determining the solder joint’s life. Stress–strain curves from various aging conditions, temperatures, and strain rates are necessary to predict the non...
| Published in: | Lecture Notes in Mechanical Engineering |
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| Main Author: | |
| Format: | Conference paper |
| Language: | English |
| Published: |
Springer Science and Business Media Deutschland GmbH
2024
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| Online Access: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85196639362&doi=10.1007%2f978-981-97-0106-3_58&partnerID=40&md5=4b8cebc77aae4ea3fc1af2cfd01a1777 |