Microstructure Evolution and Shear Strength Study of Sn–9Zn and Sn–8Zn–3Bi on Cu Substrate
In electronics assembly, solder joints not only serve as mechanical supporters-, but also as heat removers. Therefore, solder joint reliability is a major concern not only during production, but also during the life time of electronic products. It can be pointed out that reliability of solder joint...
| Published in: | Transactions on Electrical and Electronic Materials |
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| Main Author: | |
| Format: | Article |
| Language: | English |
| Published: |
Korean Institute of Electrical and Electronic Material Engineers
2024
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| Online Access: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85174314222&doi=10.1007%2fs42341-023-00481-5&partnerID=40&md5=c08659b451499d6e60cb2ae2d8958599 |