Failure prediction of the solder joints in the ball-grid-array package under thermal loading

Failure prediction of the solder joints in the ball-grid-array package under thermal loading

This paper studies the numerical failure mechanism of the solder joints in the ball grid array (BGA) package under thermal reliability process. The package consists of the silicon die, the Flame Retardant 4 (FR-4) substrate and the FR-4 printed circuit board (PCB). A total of 64 95.5Sn-4.0Ag-0.5Cu (...

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Bibliographic Details
Published in:Journal of Physics: Conference Series
Main Author: Yamin A.F.M.; Abdullah A.S.; Manap M.F.A.; Yusoff H.
Format: Conference paper
Language:English
Published: Institute of Physics Publishing 2019
Online Access:https://www.scopus.com/inward/record.uri?eid=2-s2.0-85077798675&doi=10.1088%2f1742-6596%2f1349%2f1%2f012013&partnerID=40&md5=d42d9dc9f3110db6124c7f9c9c7853ed

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https://www.scopus.com/inward/record.uri?eid=2-s2.0-85077798675&doi=10.1088%2f1742-6596%2f1349%2f1%2f012013&partnerID=40&md5=d42d9dc9f3110db6124c7f9c9c7853ed

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