Numerical investigation of heat transfer of twelve Plastic Leaded Chip Carrier (PLCC) by using computational fluid dynamic, FLUENT™ software
Plastic Leaded Chip Carrier (PLCC) package has been emerged a promising option to tackle the thermal management issue of micro-electronic devices. In the present study, three dimensional numerical analysis of heat and fluid flow through PLCC packages oriented in-line and mounted horizontally on a pr...
| Published in: | Advanced Materials Research |
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| Main Author: | |
| Format: | Conference paper |
| Language: | English |
| Published: |
2013
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| Online Access: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84886257937&doi=10.4028%2fwww.scientific.net%2fAMR.795.603&partnerID=40&md5=537a7b7920891d2d1854d32b2afbf341 |