The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC)

The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational fluid dynamic (CFD), fluent software™ using epoxy moulding compound material (EMC)

The paper present the three dimensional numerical analysis of heat and fluid flow through Plastic Leaded Chip Carrier (PLCC) packages in inline orientation horizontally mounted on a printed circuit board in a wind tunnel is carried out using a commercial CFD code, FLUENT™ by using Epoxy Moulding Com...

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Bibliographic Details
Published in:Advanced Materials Research
Main Author: Mazlan M.; Rahim A.; Iqbal M.A.; Mustafa Al Bakri A.M.; Razak W.; Mohd Sukhairi M.R.
Format: Conference paper
Language:English
Published: 2013
Online Access:https://www.scopus.com/inward/record.uri?eid=2-s2.0-84886256467&doi=10.4028%2fwww.scientific.net%2fAMR.795.174&partnerID=40&md5=76fe972c41aa9565f9d0b9f0a53ea5d3

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https://www.scopus.com/inward/record.uri?eid=2-s2.0-84886256467&doi=10.4028%2fwww.scientific.net%2fAMR.795.174&partnerID=40&md5=76fe972c41aa9565f9d0b9f0a53ea5d3

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