Morphology and intermetallics study of (Sn-8Zn-3Bi)-1Ag solder under liquid-state aging
This study investigated the effect of Ag addition on the morphology and growth rate of Cu5Zn8, Cu6Sn5 and Cu3Sn intermetallics in the Sn-8Zn-3Bi solder. The solder was prepared by mixing 1wt% of Ag into 99wt% of Sn-8Zn-3Bi solder. The intermetallics were formed by liquidstate aging, whereby the sold...
| Published in: | Advanced Materials Research |
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| Main Author: | |
| Format: | Conference paper |
| Language: | English |
| Published: |
2013
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| Online Access: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84871903571&doi=10.4028%2fwww.scientific.net%2fAMR.620.273&partnerID=40&md5=a6fd2df1e1ae092aa13e15abf55400bf |