Comparison of missing metal defect formation on He in-situ and furnace annealed electroplated copper films
Copper electrochemical plating (ECP) has contributed to a significant rise in both systematic and random defects. A "missing metal" defect is a critical problem for the 0.13 μm node and normally will only be detected after chemical-mechanical polishing (CMP). Meanwhile, this defect is also...
| Published in: | SCOReD 2006 - Proceedings of 2006 4th Student Conference on Research and Development "Towards Enhancing Research Excellence in the Region" |
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| Format: | Conference paper |
| Language: | English |
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2006
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| Online Access: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-46849111800&doi=10.1109%2fSCORED.2006.4339307&partnerID=40&md5=9ae7d92d832a8e5bd56d16697929d0e0 |