W.H, K. W. C. H. H. H. T. Y. Y. H. T. (2023). Quantifying geometrically necessary dislocation with surface roughness effect in copper (111) under indentation. Materials Science and Technology (United Kingdom), 39(3), . https://doi.org/10.1080/02670836.2022.2110700
Chicago Style (17th ed.) CitationW.H, Kok W.M.; Chuah H.G.; How H.G.; Teoh Y.H.; Yee H.M.; Tan. "Quantifying Geometrically Necessary Dislocation with Surface Roughness Effect in Copper (111) Under Indentation." Materials Science and Technology (United Kingdom) 39, no. 3 (2023). https://doi.org/10.1080/02670836.2022.2110700.
MLA (8th ed.) CitationW.H, Kok W.M.; Chuah H.G.; How H.G.; Teoh Y.H.; Yee H.M.; Tan. "Quantifying Geometrically Necessary Dislocation with Surface Roughness Effect in Copper (111) Under Indentation." Materials Science and Technology (United Kingdom), vol. 39, no. 3, 2023, https://doi.org/10.1080/02670836.2022.2110700.