A chip X-ray image bubble defect detection model combined with Dual-Former attention mechanism
Bubble defects in chip packaging can have an impact on the stability and reliability of the chip. Existing defect detection methods exhibit limited performance in identifying small-sized bubble defects and are highly susceptible to low contrast and noise in chip X-ray images, leading to missed and f...
| Published in: | MEASUREMENT |
|---|---|
| Main Authors: | , , , |
| Format: | Article |
| Language: | English |
| Published: |
ELSEVIER SCI LTD
2025
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| Subjects: | |
| Online Access: | https://www-webofscience-com.uitm.idm.oclc.org/wos/woscc/full-record/WOS:001423166800001 |