The effect of deposition time on the morphology of CuS electrodes fabricated by chemical bath deposition for supercapacitor applications (vol 130, 834, 2024)

Bibliographic Details
Published in:	APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
Main Authors:	Abdullah, Huda; Sundararaj, Miharaj; Selvanathan, Vidhya; Naim, Norshafadzila Mohammad; Akhtaruzzaman, Md; Othman, Mohd Hafiz Dzarfan; Yap, Wing Fen; Mohmad, Abdul Rahman; Azman, Nur Jannah; Ahmad, Md Fauzi; Sampe, Jahariah; Yuliarto, Brian
Format:	Correction
Language:	English
Published:	SPRINGER HEIDELBERG 2025
Subjects:	Materials Science; Physics
Online Access:	https://www-webofscience-com.uitm.idm.oclc.org/wos/woscc/full-recordWOS:001375563700004

author	Abdullah Huda; Sundararaj Miharaj; Selvanathan Vidhya; Naim Norshafadzila Mohammad; Akhtaruzzaman Md; Othman Mohd Hafiz Dzarfan; Yap Wing Fen; Mohmad Abdul Rahman; Azman Nur Jannah; Ahmad Md Fauzi; Sampe Jahariah; Yuliarto Brian
spellingShingle	Abdullah Huda; Sundararaj Miharaj; Selvanathan Vidhya; Naim Norshafadzila Mohammad; Akhtaruzzaman Md; Othman Mohd Hafiz Dzarfan; Yap Wing Fen; Mohmad Abdul Rahman; Azman Nur Jannah; Ahmad Md Fauzi; Sampe Jahariah; Yuliarto Brian The effect of deposition time on the morphology of CuS electrodes fabricated by chemical bath deposition for supercapacitor applications (vol 130, 834, 2024) Materials Science; Physics
author_facet	Abdullah Huda; Sundararaj Miharaj; Selvanathan Vidhya; Naim Norshafadzila Mohammad; Akhtaruzzaman Md; Othman Mohd Hafiz Dzarfan; Yap Wing Fen; Mohmad Abdul Rahman; Azman Nur Jannah; Ahmad Md Fauzi; Sampe Jahariah; Yuliarto Brian
author_sort	Abdullah
spelling	Abdullah, Huda; Sundararaj, Miharaj; Selvanathan, Vidhya; Naim, Norshafadzila Mohammad; Akhtaruzzaman, Md; Othman, Mohd Hafiz Dzarfan; Yap, Wing Fen; Mohmad, Abdul Rahman; Azman, Nur Jannah; Ahmad, Md Fauzi; Sampe, Jahariah; Yuliarto, Brian The effect of deposition time on the morphology of CuS electrodes fabricated by chemical bath deposition for supercapacitor applications (vol 130, 834, 2024) APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING English Correction SPRINGER HEIDELBERG 0947-8396 1432-0630 2025 131 1 10.1007/s00339-024-08135-w Materials Science; Physics hybrid WOS:001375563700004 https://www-webofscience-com.uitm.idm.oclc.org/wos/woscc/full-recordWOS:001375563700004
title	The effect of deposition time on the morphology of CuS electrodes fabricated by chemical bath deposition for supercapacitor applications (vol 130, 834, 2024)
title_short	The effect of deposition time on the morphology of CuS electrodes fabricated by chemical bath deposition for supercapacitor applications (vol 130, 834, 2024)
title_full	The effect of deposition time on the morphology of CuS electrodes fabricated by chemical bath deposition for supercapacitor applications (vol 130, 834, 2024)
title_fullStr	The effect of deposition time on the morphology of CuS electrodes fabricated by chemical bath deposition for supercapacitor applications (vol 130, 834, 2024)
title_full_unstemmed	The effect of deposition time on the morphology of CuS electrodes fabricated by chemical bath deposition for supercapacitor applications (vol 130, 834, 2024)
title_sort	The effect of deposition time on the morphology of CuS electrodes fabricated by chemical bath deposition for supercapacitor applications (vol 130, 834, 2024)
container_title	APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
language	English
format	Correction
description
publisher	SPRINGER HEIDELBERG
issn	0947-8396 1432-0630
publishDate	2025
container_volume	131
container_issue	1
doi_str_mv	10.1007/s00339-024-08135-w
topic	Materials Science; Physics
topic_facet	Materials Science; Physics
accesstype	hybrid
id	WOS:001375563700004
url	https://www-webofscience-com.uitm.idm.oclc.org/wos/woscc/full-recordWOS:001375563700004
record_format	wos
collection	Web of Science (WoS)
_version_	1820775410804195328

The effect of deposition time on the morphology of CuS electrodes fabricated by chemical bath deposition for supercapacitor applications (vol 130, 834, 2024)

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