The effect of deposition time on the morphology of CuS electrodes fabricated by chemical bath deposition for supercapacitor applications

This paper presents the synthesis of copper sulfide (CuS) electrode utilizing chemical bath deposition (CBD) and the study of the effect of complexing agent on the morphology of CuS electrode. The aim of this study is to find the ideal time for the synthesis of CuS and to find the capacitance and hi...

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Published in:APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
Main Authors: Abdullah, Huda; Sundararaj, Miharaj; Selvanathan, Vidhya; Naim, Norshafadzila Mohammad; Akhtaruzzaman, Md; Othman, Mohd Hafiz Dzarfan; Yap, Wing Fen; Mohmad, Abdul Rahman; Azman, Nur Jannah; Ahmad, Md Fauzi; Sampe, Jahariah; Yuliarto, Brian
Format: Article
Language:English
Published: SPRINGER HEIDELBERG 2024
Subjects:
Online Access:https://www-webofscience-com.uitm.idm.oclc.org/wos/woscc/full-record/WOS:001345473600001
author Abdullah
Huda; Sundararaj
Miharaj; Selvanathan
Vidhya; Naim
Norshafadzila Mohammad; Akhtaruzzaman
Md; Othman
Mohd Hafiz Dzarfan; Yap
Wing Fen; Mohmad
Abdul Rahman; Azman
Nur Jannah; Ahmad
Md Fauzi; Sampe
Jahariah; Yuliarto
Brian
spellingShingle Abdullah
Huda; Sundararaj
Miharaj; Selvanathan
Vidhya; Naim
Norshafadzila Mohammad; Akhtaruzzaman
Md; Othman
Mohd Hafiz Dzarfan; Yap
Wing Fen; Mohmad
Abdul Rahman; Azman
Nur Jannah; Ahmad
Md Fauzi; Sampe
Jahariah; Yuliarto
Brian
The effect of deposition time on the morphology of CuS electrodes fabricated by chemical bath deposition for supercapacitor applications
Materials Science; Physics
author_facet Abdullah
Huda; Sundararaj
Miharaj; Selvanathan
Vidhya; Naim
Norshafadzila Mohammad; Akhtaruzzaman
Md; Othman
Mohd Hafiz Dzarfan; Yap
Wing Fen; Mohmad
Abdul Rahman; Azman
Nur Jannah; Ahmad
Md Fauzi; Sampe
Jahariah; Yuliarto
Brian
author_sort Abdullah
spelling Abdullah, Huda; Sundararaj, Miharaj; Selvanathan, Vidhya; Naim, Norshafadzila Mohammad; Akhtaruzzaman, Md; Othman, Mohd Hafiz Dzarfan; Yap, Wing Fen; Mohmad, Abdul Rahman; Azman, Nur Jannah; Ahmad, Md Fauzi; Sampe, Jahariah; Yuliarto, Brian
The effect of deposition time on the morphology of CuS electrodes fabricated by chemical bath deposition for supercapacitor applications
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
English
Article
This paper presents the synthesis of copper sulfide (CuS) electrode utilizing chemical bath deposition (CBD) and the study of the effect of complexing agent on the morphology of CuS electrode. The aim of this study is to find the ideal time for the synthesis of CuS and to find the capacitance and highest potential of the CuS electrode synthesized at the ideal time. In this project, CuS solution is formed using copper (II) sulphate (CuSO4) solution, thioacetamide solution, and a complexing agent which is citric acid. Homogeneous ultrathin nanospheres of CuS thin films have been successfully developed on nickel foam (NF) by simple and low-cost CBD method which is a promising electrode material for high-performance supercapacitors. The CBD process was carried out at different time intervals which are 30, 60, 90 and 120 min to find the ideal deposition time for CuS/NF electrode fabrication. The surface morphological analysis showed uniform growth of CuS nanospheres on NF surface. Structural analysis confirms the formation of hexagonal crystal structure of CuS. The electrochemical performances were tested by cyclic voltammetry, galvanostatic charge/discharge and electrochemical impedance techniques. The best capacitance that was recorded by CuS fabricated at 60 min with a specific capacitance of 615 F/g at 1 A/g current density. Hence, the ideal deposition time of CuS/NF electrode fabrication for high supercapacitor performance is 60 min. The encouraging results suggest that CuS nanoflakes prepared by chemical bath deposition can serve as promising electrode materials for high performance supercapacitors in the future.
SPRINGER HEIDELBERG
0947-8396
1432-0630
2024
130
11
10.1007/s00339-024-08008-2
Materials Science; Physics

WOS:001345473600001
https://www-webofscience-com.uitm.idm.oclc.org/wos/woscc/full-record/WOS:001345473600001
title The effect of deposition time on the morphology of CuS electrodes fabricated by chemical bath deposition for supercapacitor applications
title_short The effect of deposition time on the morphology of CuS electrodes fabricated by chemical bath deposition for supercapacitor applications
title_full The effect of deposition time on the morphology of CuS electrodes fabricated by chemical bath deposition for supercapacitor applications
title_fullStr The effect of deposition time on the morphology of CuS electrodes fabricated by chemical bath deposition for supercapacitor applications
title_full_unstemmed The effect of deposition time on the morphology of CuS electrodes fabricated by chemical bath deposition for supercapacitor applications
title_sort The effect of deposition time on the morphology of CuS electrodes fabricated by chemical bath deposition for supercapacitor applications
container_title APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
language English
format Article
description This paper presents the synthesis of copper sulfide (CuS) electrode utilizing chemical bath deposition (CBD) and the study of the effect of complexing agent on the morphology of CuS electrode. The aim of this study is to find the ideal time for the synthesis of CuS and to find the capacitance and highest potential of the CuS electrode synthesized at the ideal time. In this project, CuS solution is formed using copper (II) sulphate (CuSO4) solution, thioacetamide solution, and a complexing agent which is citric acid. Homogeneous ultrathin nanospheres of CuS thin films have been successfully developed on nickel foam (NF) by simple and low-cost CBD method which is a promising electrode material for high-performance supercapacitors. The CBD process was carried out at different time intervals which are 30, 60, 90 and 120 min to find the ideal deposition time for CuS/NF electrode fabrication. The surface morphological analysis showed uniform growth of CuS nanospheres on NF surface. Structural analysis confirms the formation of hexagonal crystal structure of CuS. The electrochemical performances were tested by cyclic voltammetry, galvanostatic charge/discharge and electrochemical impedance techniques. The best capacitance that was recorded by CuS fabricated at 60 min with a specific capacitance of 615 F/g at 1 A/g current density. Hence, the ideal deposition time of CuS/NF electrode fabrication for high supercapacitor performance is 60 min. The encouraging results suggest that CuS nanoflakes prepared by chemical bath deposition can serve as promising electrode materials for high performance supercapacitors in the future.
publisher SPRINGER HEIDELBERG
issn 0947-8396
1432-0630
publishDate 2024
container_volume 130
container_issue 11
doi_str_mv 10.1007/s00339-024-08008-2
topic Materials Science; Physics
topic_facet Materials Science; Physics
accesstype
id WOS:001345473600001
url https://www-webofscience-com.uitm.idm.oclc.org/wos/woscc/full-record/WOS:001345473600001
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collection Web of Science (WoS)
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