Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications
This study investigates the performance of microheaters, focusing on three different configurations: s-shape, serpentine, and dual C shapes for microfluidic applications. Each configuration is characterized by electrical, thermal, and structural simulations via the ANSYS tool. The electrical analysi...
Published in: | 2024 IEEE 14TH SYMPOSIUM ON COMPUTER APPLICATIONS & INDUSTRIAL ELECTRONICS, ISCAIE 2024 |
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Format: | Proceedings Paper |
Language: | English |
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IEEE
2024
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Online Access: | https://www-webofscience-com.uitm.idm.oclc.org/wos/woscc/full-record/WOS:001283898700002 |
author |
Nasarudin Wan Najmi Nuqman Wan; Husaini Yusnira; Yaakub Tuan Norjihan Tuan |
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Nasarudin Wan Najmi Nuqman Wan; Husaini Yusnira; Yaakub Tuan Norjihan Tuan Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications Computer Science; Engineering |
author_facet |
Nasarudin Wan Najmi Nuqman Wan; Husaini Yusnira; Yaakub Tuan Norjihan Tuan |
author_sort |
Nasarudin |
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Nasarudin, Wan Najmi Nuqman Wan; Husaini, Yusnira; Yaakub, Tuan Norjihan Tuan Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications 2024 IEEE 14TH SYMPOSIUM ON COMPUTER APPLICATIONS & INDUSTRIAL ELECTRONICS, ISCAIE 2024 English Proceedings Paper This study investigates the performance of microheaters, focusing on three different configurations: s-shape, serpentine, and dual C shapes for microfluidic applications. Each configuration is characterized by electrical, thermal, and structural simulations via the ANSYS tool. The electrical analysis reveals distinct variations in joule heat generation, while steady-state thermal analysis provides insights into temperature distribution and heat dissipation profiles. Static structural analysis elucidates variations in deformation, stress, and strain energy accumulation, offering critical insights into structural integrity and stability. By using the Taguchi Method, the main effect plots show how electrical parameters affect thermal and structural behavior. Higher current levels are linked to more deformation and stress. The S shape emerges as the most promising design, demonstrating consistent thermal and structural responses and lower levels of deformation and stress. IEEE 2836-4864 2024 10.1109/ISCAIE61308.2024.10576212 Computer Science; Engineering WOS:001283898700002 https://www-webofscience-com.uitm.idm.oclc.org/wos/woscc/full-record/WOS:001283898700002 |
title |
Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications |
title_short |
Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications |
title_full |
Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications |
title_fullStr |
Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications |
title_full_unstemmed |
Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications |
title_sort |
Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications |
container_title |
2024 IEEE 14TH SYMPOSIUM ON COMPUTER APPLICATIONS & INDUSTRIAL ELECTRONICS, ISCAIE 2024 |
language |
English |
format |
Proceedings Paper |
description |
This study investigates the performance of microheaters, focusing on three different configurations: s-shape, serpentine, and dual C shapes for microfluidic applications. Each configuration is characterized by electrical, thermal, and structural simulations via the ANSYS tool. The electrical analysis reveals distinct variations in joule heat generation, while steady-state thermal analysis provides insights into temperature distribution and heat dissipation profiles. Static structural analysis elucidates variations in deformation, stress, and strain energy accumulation, offering critical insights into structural integrity and stability. By using the Taguchi Method, the main effect plots show how electrical parameters affect thermal and structural behavior. Higher current levels are linked to more deformation and stress. The S shape emerges as the most promising design, demonstrating consistent thermal and structural responses and lower levels of deformation and stress. |
publisher |
IEEE |
issn |
2836-4864 |
publishDate |
2024 |
container_volume |
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container_issue |
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doi_str_mv |
10.1109/ISCAIE61308.2024.10576212 |
topic |
Computer Science; Engineering |
topic_facet |
Computer Science; Engineering |
accesstype |
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id |
WOS:001283898700002 |
url |
https://www-webofscience-com.uitm.idm.oclc.org/wos/woscc/full-record/WOS:001283898700002 |
record_format |
wos |
collection |
Web of Science (WoS) |
_version_ |
1823296085526839296 |