Particles contaminations detection during plasma etching process by using k-nearest neighbors and Fuzzy k-nearest neighbors

Particles contaminations detection during plasma etching process by using k-nearest neighbors and Fuzzy k-nearest neighbors

This paper present the particle contamination detection during plasma etching process by using k-nearest neighbor (kNN) and Fuzzy k-nearest neighbor (FkNN). In the process of manufacturing semiconductor devices, detecting particle contamination in process tool is a vital factor for determining for p...

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التفاصيل البيبلوغرافية
الحاوية / القاعدة:Proceedings - 6th IEEE International Conference on Control System, Computing and Engineering, ICCSCE 2016
المؤلف الرئيسي: 2-s2.0-85018974073
التنسيق: Conference paper
اللغة:English
منشور في: Institute of Electrical and Electronics Engineers Inc. 2017
الوصول للمادة أونلاين:https://www.scopus.com/inward/record.uri?eid=2-s2.0-85018974073&doi=10.1109%2fICCSCE.2016.7893630&partnerID=40&md5=f742d84246ce038b6844e0636e8cdf5f

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