Analysis of crack propagation of PLA fabricated by the additive manufacturing technique

• Published in: Engineering Research Express
• Main Author: Mohd Yusof A.A.B.; Md Yusop A.H.B.; Abu Kasim H.B.
• Format: Article
• Language: English
• Published: Institute of Physics 2024
• Online Access: https://www.scopus.com/inward/record.uri?eid=2-s2.0-85199378992&doi=10.1088%2f2631-8695%2fad62ae&partnerID=40&md5=7b4d88a74a4b2e5098b64d45f6c1a1b0

Understanding crack propagation is crucial for evaluating the structural integrity and reliability of additive manufacturing components, as cracks can compromise mechanical properties and potentially lead to catastrophic failures. The study of crack propagation in additive manufacturing components is used to develop strategies for mitigating crack initiation and growth, improving material properties, and optimising the design and manufacturing processes. Crack propagation in additive manufacturing components can be influenced by various factors, including material properties, design considerations, manufacturing defects, and loading conditions. Due to the identified issue, the study was carried out to investigate the crack propagation of the Fused Deposition Modeling (FDM) component using compact tension fracture testing. The experimental work started with fabricating the samples using PLA material, followed by a fracture test based on the compact tension specimen test to get a response of the structure and its crack propagation under tensile. Material properties were also collected using the dog bone tensile test. The material properties of the testing were then imported to Finite Element Analysis for further investigation of fracture mechanics. It was found that the maximum force of the sample was 141.7 ± 28 N at 1.70 ± 0.26 mm displacement, and cracks initiated around the tip and propagated upward or downward based on the initial crack location. The deformation patterns of PLA material have shown it to be brittle plastic deformation and low energy absorption before fracture. © 2024 IOP Publishing Ltd.