Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications
This study investigates the performance of microheaters, focusing on three different configurations: s-shape, serpentine, and dual C shapes for microfluidic applications. Each configuration is characterized by electrical, thermal, and structural simulations via the ANSYS tool. The electrical analysi...
Published in: | 14th IEEE Symposium on Computer Applications and Industrial Electronics, ISCAIE 2024 |
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Institute of Electrical and Electronics Engineers Inc.
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2-s2.0-85198906285 Nasarudin W.N.N.W.; Husaini Y.; Yaakub T.N.T. Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications 2024 14th IEEE Symposium on Computer Applications and Industrial Electronics, ISCAIE 2024 10.1109/ISCAIE61308.2024.10576212 https://www.scopus.com/inward/record.uri?eid=2-s2.0-85198906285&doi=10.1109%2fISCAIE61308.2024.10576212&partnerID=40&md5=bb9e2f60838fb6344a0f3e9f2b0da4e7 This study investigates the performance of microheaters, focusing on three different configurations: s-shape, serpentine, and dual C shapes for microfluidic applications. Each configuration is characterized by electrical, thermal, and structural simulations via the ANSYS tool. The electrical analysis reveals distinct variations in joule heat generation, while steady-state thermal analysis provides insights into temperature distribution and heat dissipation profiles. Static structural analysis elucidates variations in deformation, stress, and strain energy accumulation, offering critical insights into structural integrity and stability. By using the Taguchi Method, the main effect plots show how electrical parameters affect thermal and structural behavior. Higher current levels are linked to more deformation and stress. The S shape emerges as the most promising design, demonstrating consistent thermal and structural responses and lower levels of deformation and stress. © 2024 IEEE. Institute of Electrical and Electronics Engineers Inc. English Conference paper |
author |
Nasarudin W.N.N.W.; Husaini Y.; Yaakub T.N.T. |
spellingShingle |
Nasarudin W.N.N.W.; Husaini Y.; Yaakub T.N.T. Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications |
author_facet |
Nasarudin W.N.N.W.; Husaini Y.; Yaakub T.N.T. |
author_sort |
Nasarudin W.N.N.W.; Husaini Y.; Yaakub T.N.T. |
title |
Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications |
title_short |
Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications |
title_full |
Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications |
title_fullStr |
Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications |
title_full_unstemmed |
Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications |
title_sort |
Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications |
publishDate |
2024 |
container_title |
14th IEEE Symposium on Computer Applications and Industrial Electronics, ISCAIE 2024 |
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container_issue |
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doi_str_mv |
10.1109/ISCAIE61308.2024.10576212 |
url |
https://www.scopus.com/inward/record.uri?eid=2-s2.0-85198906285&doi=10.1109%2fISCAIE61308.2024.10576212&partnerID=40&md5=bb9e2f60838fb6344a0f3e9f2b0da4e7 |
description |
This study investigates the performance of microheaters, focusing on three different configurations: s-shape, serpentine, and dual C shapes for microfluidic applications. Each configuration is characterized by electrical, thermal, and structural simulations via the ANSYS tool. The electrical analysis reveals distinct variations in joule heat generation, while steady-state thermal analysis provides insights into temperature distribution and heat dissipation profiles. Static structural analysis elucidates variations in deformation, stress, and strain energy accumulation, offering critical insights into structural integrity and stability. By using the Taguchi Method, the main effect plots show how electrical parameters affect thermal and structural behavior. Higher current levels are linked to more deformation and stress. The S shape emerges as the most promising design, demonstrating consistent thermal and structural responses and lower levels of deformation and stress. © 2024 IEEE. |
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Institute of Electrical and Electronics Engineers Inc. |
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English |
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Conference paper |
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scopus |
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Scopus |
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1814778503150698496 |