Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications

This study investigates the performance of microheaters, focusing on three different configurations: s-shape, serpentine, and dual C shapes for microfluidic applications. Each configuration is characterized by electrical, thermal, and structural simulations via the ANSYS tool. The electrical analysi...

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Published in:14th IEEE Symposium on Computer Applications and Industrial Electronics, ISCAIE 2024
Main Author: Nasarudin W.N.N.W.; Husaini Y.; Yaakub T.N.T.
Format: Conference paper
Language:English
Published: Institute of Electrical and Electronics Engineers Inc. 2024
Online Access:https://www.scopus.com/inward/record.uri?eid=2-s2.0-85198906285&doi=10.1109%2fISCAIE61308.2024.10576212&partnerID=40&md5=bb9e2f60838fb6344a0f3e9f2b0da4e7
id 2-s2.0-85198906285
spelling 2-s2.0-85198906285
Nasarudin W.N.N.W.; Husaini Y.; Yaakub T.N.T.
Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications
2024
14th IEEE Symposium on Computer Applications and Industrial Electronics, ISCAIE 2024


10.1109/ISCAIE61308.2024.10576212
https://www.scopus.com/inward/record.uri?eid=2-s2.0-85198906285&doi=10.1109%2fISCAIE61308.2024.10576212&partnerID=40&md5=bb9e2f60838fb6344a0f3e9f2b0da4e7
This study investigates the performance of microheaters, focusing on three different configurations: s-shape, serpentine, and dual C shapes for microfluidic applications. Each configuration is characterized by electrical, thermal, and structural simulations via the ANSYS tool. The electrical analysis reveals distinct variations in joule heat generation, while steady-state thermal analysis provides insights into temperature distribution and heat dissipation profiles. Static structural analysis elucidates variations in deformation, stress, and strain energy accumulation, offering critical insights into structural integrity and stability. By using the Taguchi Method, the main effect plots show how electrical parameters affect thermal and structural behavior. Higher current levels are linked to more deformation and stress. The S shape emerges as the most promising design, demonstrating consistent thermal and structural responses and lower levels of deformation and stress. © 2024 IEEE.
Institute of Electrical and Electronics Engineers Inc.

English
Conference paper

author Nasarudin W.N.N.W.; Husaini Y.; Yaakub T.N.T.
spellingShingle Nasarudin W.N.N.W.; Husaini Y.; Yaakub T.N.T.
Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications
author_facet Nasarudin W.N.N.W.; Husaini Y.; Yaakub T.N.T.
author_sort Nasarudin W.N.N.W.; Husaini Y.; Yaakub T.N.T.
title Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications
title_short Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications
title_full Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications
title_fullStr Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications
title_full_unstemmed Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications
title_sort Microheater Comparative Study of S-Shape, Serpentine, and Dual C Configurations for Microfluidic Applications
publishDate 2024
container_title 14th IEEE Symposium on Computer Applications and Industrial Electronics, ISCAIE 2024
container_volume
container_issue
doi_str_mv 10.1109/ISCAIE61308.2024.10576212
url https://www.scopus.com/inward/record.uri?eid=2-s2.0-85198906285&doi=10.1109%2fISCAIE61308.2024.10576212&partnerID=40&md5=bb9e2f60838fb6344a0f3e9f2b0da4e7
description This study investigates the performance of microheaters, focusing on three different configurations: s-shape, serpentine, and dual C shapes for microfluidic applications. Each configuration is characterized by electrical, thermal, and structural simulations via the ANSYS tool. The electrical analysis reveals distinct variations in joule heat generation, while steady-state thermal analysis provides insights into temperature distribution and heat dissipation profiles. Static structural analysis elucidates variations in deformation, stress, and strain energy accumulation, offering critical insights into structural integrity and stability. By using the Taguchi Method, the main effect plots show how electrical parameters affect thermal and structural behavior. Higher current levels are linked to more deformation and stress. The S shape emerges as the most promising design, demonstrating consistent thermal and structural responses and lower levels of deformation and stress. © 2024 IEEE.
publisher Institute of Electrical and Electronics Engineers Inc.
issn
language English
format Conference paper
accesstype
record_format scopus
collection Scopus
_version_ 1814778503150698496