YOLO Algorithm with Hybrid Attention Feature Pyramid Network for Solder Joint Defect Detection

Traditional manual detection for solder joint defect is no longer applied during industrial production due to low efficiency, inconsistent evaluation, high cost, and lack of real-time data. A new approach has been proposed to address the issues of low accuracy, high false detection rates, and comput...

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Published in:IEEE Transactions on Components, Packaging and Manufacturing Technology
Main Author: Li A.; Hamzah R.; Khatijah Nor Abdul Rahim S.; Gao Y.
Format: Article
Language:English
Published: Institute of Electrical and Electronics Engineers Inc. 2024
Online Access:https://www.scopus.com/inward/record.uri?eid=2-s2.0-85195364238&doi=10.1109%2fTCPMT.2024.3409773&partnerID=40&md5=0c82a1e7b1f4481e8f2566359961180f
id 2-s2.0-85195364238
spelling 2-s2.0-85195364238
Li A.; Hamzah R.; Khatijah Nor Abdul Rahim S.; Gao Y.
YOLO Algorithm with Hybrid Attention Feature Pyramid Network for Solder Joint Defect Detection
2024
IEEE Transactions on Components, Packaging and Manufacturing Technology
14
8
10.1109/TCPMT.2024.3409773
https://www.scopus.com/inward/record.uri?eid=2-s2.0-85195364238&doi=10.1109%2fTCPMT.2024.3409773&partnerID=40&md5=0c82a1e7b1f4481e8f2566359961180f
Traditional manual detection for solder joint defect is no longer applied during industrial production due to low efficiency, inconsistent evaluation, high cost, and lack of real-time data. A new approach has been proposed to address the issues of low accuracy, high false detection rates, and computational cost of solder joint defect detection in surface mount technology of industrial scenarios. The proposed solution is a hybrid attention mechanism (HAM) designed specifically for the solder joint defect detection algorithm to improve quality control in the manufacturing process by increasing the accuracy while reducing the computational cost. The HAM comprises a proposed enhanced multihead self-attention and coordinate attention (CA) mechanisms to increase the ability of attention networks to perceive contextual information and enhance the utilization range of network features. The CA mechanism enhances the connection between different channels and reduces location information loss. The HAM enhances the capability of the network to perceive long-distance position information and learn local features. The improved algorithm model has good detection ability for solder joint defect detection, with mean average precision (mAP) reaching 91.5% and 4.3% higher than the You Only Look Once version 5 (YOLOv5) algorithm and better than other comparative algorithms. Compared to other versions, mAP, precision, recall, F1-score, and frame per seconds indicators have also improved. The improvement of detection accuracy can be achieved while meeting real-time detection requirements. © 2024 IEEE. Personal use is permitted, but republication/redistribution requires IEEE permission.
Institute of Electrical and Electronics Engineers Inc.
21563950
English
Article
All Open Access; Green Open Access
author Li A.; Hamzah R.; Khatijah Nor Abdul Rahim S.; Gao Y.
spellingShingle Li A.; Hamzah R.; Khatijah Nor Abdul Rahim S.; Gao Y.
YOLO Algorithm with Hybrid Attention Feature Pyramid Network for Solder Joint Defect Detection
author_facet Li A.; Hamzah R.; Khatijah Nor Abdul Rahim S.; Gao Y.
author_sort Li A.; Hamzah R.; Khatijah Nor Abdul Rahim S.; Gao Y.
title YOLO Algorithm with Hybrid Attention Feature Pyramid Network for Solder Joint Defect Detection
title_short YOLO Algorithm with Hybrid Attention Feature Pyramid Network for Solder Joint Defect Detection
title_full YOLO Algorithm with Hybrid Attention Feature Pyramid Network for Solder Joint Defect Detection
title_fullStr YOLO Algorithm with Hybrid Attention Feature Pyramid Network for Solder Joint Defect Detection
title_full_unstemmed YOLO Algorithm with Hybrid Attention Feature Pyramid Network for Solder Joint Defect Detection
title_sort YOLO Algorithm with Hybrid Attention Feature Pyramid Network for Solder Joint Defect Detection
publishDate 2024
container_title IEEE Transactions on Components, Packaging and Manufacturing Technology
container_volume 14
container_issue 8
doi_str_mv 10.1109/TCPMT.2024.3409773
url https://www.scopus.com/inward/record.uri?eid=2-s2.0-85195364238&doi=10.1109%2fTCPMT.2024.3409773&partnerID=40&md5=0c82a1e7b1f4481e8f2566359961180f
description Traditional manual detection for solder joint defect is no longer applied during industrial production due to low efficiency, inconsistent evaluation, high cost, and lack of real-time data. A new approach has been proposed to address the issues of low accuracy, high false detection rates, and computational cost of solder joint defect detection in surface mount technology of industrial scenarios. The proposed solution is a hybrid attention mechanism (HAM) designed specifically for the solder joint defect detection algorithm to improve quality control in the manufacturing process by increasing the accuracy while reducing the computational cost. The HAM comprises a proposed enhanced multihead self-attention and coordinate attention (CA) mechanisms to increase the ability of attention networks to perceive contextual information and enhance the utilization range of network features. The CA mechanism enhances the connection between different channels and reduces location information loss. The HAM enhances the capability of the network to perceive long-distance position information and learn local features. The improved algorithm model has good detection ability for solder joint defect detection, with mean average precision (mAP) reaching 91.5% and 4.3% higher than the You Only Look Once version 5 (YOLOv5) algorithm and better than other comparative algorithms. Compared to other versions, mAP, precision, recall, F1-score, and frame per seconds indicators have also improved. The improvement of detection accuracy can be achieved while meeting real-time detection requirements. © 2024 IEEE. Personal use is permitted, but republication/redistribution requires IEEE permission.
publisher Institute of Electrical and Electronics Engineers Inc.
issn 21563950
language English
format Article
accesstype All Open Access; Green Open Access
record_format scopus
collection Scopus
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