Determination of the Anand Parameters for SAC405 Solders through the Use of Stress-Strain Data

The Anand inelastic constitutive model is commonly employed to depict the deformation behaviour of solders in electronics components. In the Anand model, plasticity and creep are coupled and described by the same set of flow and evolution relations. Literature study reveals that researchers have cal...

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Published in:Journal of Advanced Research in Applied Mechanics
Main Author: Rizaman M.S.A.; Abdullah A.S.; Yamin A.F.M.
Format: Article
Language:English
Published: Semarak Ilmu Publishing 2024
Online Access:https://www.scopus.com/inward/record.uri?eid=2-s2.0-85183885231&doi=10.37934%2faram.113.1.162175&partnerID=40&md5=6990250024bd6bc9cd5aa09275c19327
id 2-s2.0-85183885231
spelling 2-s2.0-85183885231
Rizaman M.S.A.; Abdullah A.S.; Yamin A.F.M.
Determination of the Anand Parameters for SAC405 Solders through the Use of Stress-Strain Data
2024
Journal of Advanced Research in Applied Mechanics
113
1
10.37934/aram.113.1.162175
https://www.scopus.com/inward/record.uri?eid=2-s2.0-85183885231&doi=10.37934%2faram.113.1.162175&partnerID=40&md5=6990250024bd6bc9cd5aa09275c19327
The Anand inelastic constitutive model is commonly employed to depict the deformation behaviour of solders in electronics components. In the Anand model, plasticity and creep are coupled and described by the same set of flow and evolution relations. Literature study reveals that researchers have calculated varying values for the Anand model parameters when describing different SAC solders. Using Anand's constitutive model for SAC405 (95.5Sn-4.0Ag-0.5Cu) lead-free solder, the theoretical equations for the solder's uniaxial stress-strain response were obtained in this paper. The steps to obtain the parameters of Anand model using stress-strain were also determined. Data on uniaxial stress and strain at various temperatures (T = 298 K (25 °C), 323 K (50 °C), 348 K (75 °C), 373 K (100 °C), and 398 K (125 °C)) and strain rates (ε̇ = 1 × 10-3 sec-1, 1 × 10-4 sec-1, and 1 × 10-4 sec-1) was used to calculate the Anand parameters. The Anand model's accuracy (goodness of fit) with the retrieved parameters was assessed by comparing the model's findings to the observed stress-strain data. The Anand model consistently generated good predictions of the empirical data in all cases, across a wide range of temperatures and stress-strain levels. The goodness of fit values obtained were 0.992, 0.983 and 0.982 for strain rate 1 × 10-3 sec-1, 1 × 10-4 sec-1 and 1 × 10-5 sec-1 respectively. © 2024, Semarak Ilmu Publishing. All rights reserved.
Semarak Ilmu Publishing
22897895
English
Article
All Open Access; Gold Open Access
author Rizaman M.S.A.; Abdullah A.S.; Yamin A.F.M.
spellingShingle Rizaman M.S.A.; Abdullah A.S.; Yamin A.F.M.
Determination of the Anand Parameters for SAC405 Solders through the Use of Stress-Strain Data
author_facet Rizaman M.S.A.; Abdullah A.S.; Yamin A.F.M.
author_sort Rizaman M.S.A.; Abdullah A.S.; Yamin A.F.M.
title Determination of the Anand Parameters for SAC405 Solders through the Use of Stress-Strain Data
title_short Determination of the Anand Parameters for SAC405 Solders through the Use of Stress-Strain Data
title_full Determination of the Anand Parameters for SAC405 Solders through the Use of Stress-Strain Data
title_fullStr Determination of the Anand Parameters for SAC405 Solders through the Use of Stress-Strain Data
title_full_unstemmed Determination of the Anand Parameters for SAC405 Solders through the Use of Stress-Strain Data
title_sort Determination of the Anand Parameters for SAC405 Solders through the Use of Stress-Strain Data
publishDate 2024
container_title Journal of Advanced Research in Applied Mechanics
container_volume 113
container_issue 1
doi_str_mv 10.37934/aram.113.1.162175
url https://www.scopus.com/inward/record.uri?eid=2-s2.0-85183885231&doi=10.37934%2faram.113.1.162175&partnerID=40&md5=6990250024bd6bc9cd5aa09275c19327
description The Anand inelastic constitutive model is commonly employed to depict the deformation behaviour of solders in electronics components. In the Anand model, plasticity and creep are coupled and described by the same set of flow and evolution relations. Literature study reveals that researchers have calculated varying values for the Anand model parameters when describing different SAC solders. Using Anand's constitutive model for SAC405 (95.5Sn-4.0Ag-0.5Cu) lead-free solder, the theoretical equations for the solder's uniaxial stress-strain response were obtained in this paper. The steps to obtain the parameters of Anand model using stress-strain were also determined. Data on uniaxial stress and strain at various temperatures (T = 298 K (25 °C), 323 K (50 °C), 348 K (75 °C), 373 K (100 °C), and 398 K (125 °C)) and strain rates (ε̇ = 1 × 10-3 sec-1, 1 × 10-4 sec-1, and 1 × 10-4 sec-1) was used to calculate the Anand parameters. The Anand model's accuracy (goodness of fit) with the retrieved parameters was assessed by comparing the model's findings to the observed stress-strain data. The Anand model consistently generated good predictions of the empirical data in all cases, across a wide range of temperatures and stress-strain levels. The goodness of fit values obtained were 0.992, 0.983 and 0.982 for strain rate 1 × 10-3 sec-1, 1 × 10-4 sec-1 and 1 × 10-5 sec-1 respectively. © 2024, Semarak Ilmu Publishing. All rights reserved.
publisher Semarak Ilmu Publishing
issn 22897895
language English
format Article
accesstype All Open Access; Gold Open Access
record_format scopus
collection Scopus
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