Automated Storage Systems for Electronic Components with Temperature and Humidity Sensing Capabilities
Thermal expansion and contraction of electronic component materials can be caused by extreme heat or cold. Plastic casings and metal components undergo thermal expansion and contraction, resulting in changes in their dimensions and shape in response to variations in temperature. These variations may...
| Published in: | 2023 IEEE International Conference on Applied Electronics and Engineering, ICAEE 2023 |
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| Main Author: | |
| Format: | Conference paper |
| Language: | English |
| Published: |
Institute of Electrical and Electronics Engineers Inc.
2023
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| Online Access: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85180539754&doi=10.1109%2fICAEE58583.2023.10331390&partnerID=40&md5=d0f85f2b7e6cd4633085c96b5f566b8b |