| Summary: | It is undeniable that with the technological advancement in surveying through the use of terrestrial laser scanner (TLS), large amounts of high accuracy 3D data can be acquired in a short period of time. At the same time, Matterport is able to capture 3D information about locations as well. Matterport scans the area and creates a detailed 3D model using a combination of infrared sensors, depth cameras, and high-resolution RGB cameras. Therefore, the objective of this study is to analyze the accuracy of the Matterport compared to the TLS in surveying building parcels. To achieve the objective of this study, the influence of the number of stations on the output data as well as the optimal number of stations to be set up with the Matterport in building parcel surveys were investigated. Both TLS and Matterport are used for data collection in this study. For Matterport, different number of stations were applied in this study. Meanwhile, single scan station of scanning applied for the data collection using the TLS for the same parcel of building. Subsequently, the 3D data acquired by these two methods were analyzed in terms of the dimensions and area of the building parcel with different number of stations. Root mean square error (RMSE) was used for accuracy evaluation. The RMSE value in term of dimensional for TLS is lower compared to the RMSE value for the case of Matterport, which is 0.02 m and 0.11 m respectively. However, the measurement accuracy achieved with Matterport is still sufficient in the case of strata survey. On the other hand, the difference in term of area of parcels between TLS and distometer is only 0.04m2, while Matterport with distometer is 0.46m2. With this small value of discrepancy in term of area, it can be concluded that the result in terms of area proved that the Matterport can be used in strata survey as well. In conclusion, it can be said that the use of Matterport can be helpful in future strata survey and it is practical especially surveying complex buildings with many parcels. © 2023 IEEE.
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