Improving the mechanical properties and curing characteristics of styrene-butadiene rubber/butadiene rubber composites by incorporating silicon carbide

Thermal conductive filler, silicon carbide (SiC), has been investigated for its effects on the mechanical properties, microstructural properties, physical properties, and kinetic characteristics of styrene-butadiene-rubber/butadiene rubber (SBR/BR). SBR/BR-SiC's tensile strength, strain at brea...

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Published in:Polymer Composites
Main Author: Zabihi A.; Fasihi M.; Rasouli S.; Wati Sharudin R.
Format: Article
Language:English
Published: John Wiley and Sons Inc 2024
Online Access:https://www.scopus.com/inward/record.uri?eid=2-s2.0-85175522173&doi=10.1002%2fpc.27881&partnerID=40&md5=984787f8e6a19779539b29574729e7d8
id 2-s2.0-85175522173
spelling 2-s2.0-85175522173
Zabihi A.; Fasihi M.; Rasouli S.; Wati Sharudin R.
Improving the mechanical properties and curing characteristics of styrene-butadiene rubber/butadiene rubber composites by incorporating silicon carbide
2024
Polymer Composites
45
2
10.1002/pc.27881
https://www.scopus.com/inward/record.uri?eid=2-s2.0-85175522173&doi=10.1002%2fpc.27881&partnerID=40&md5=984787f8e6a19779539b29574729e7d8
Thermal conductive filler, silicon carbide (SiC), has been investigated for its effects on the mechanical properties, microstructural properties, physical properties, and kinetic characteristics of styrene-butadiene-rubber/butadiene rubber (SBR/BR). SBR/BR-SiC's tensile strength, strain at break, and toughness were improved by 5 phr SiC content within the composite. Specifically, there was a 44% increase in tensile strength, a 51% increase in strain at break, and impressive 113% increase in toughness. Additionally, there was a notable reduction of approximately ~15% in the compression set. The calculated crosslink density using the Flory–Rehner equation proved that the SiC filler increased the covalent bonds between the polymer chains during the curing reaction. The rheometry results showed a reduction in the scorch and optimum curing times by ~10% via the incorporation of SiC. The addition of 5 phr SiC decreased the curing duration time by 47%. The scanning electron microscopy images taken from the samples at different magnifications showed that the particle agglomeration after SiC = 5 phr was the main factor in reducing the SiC performance in the composite. Highlights: Tensile properties of SBR/BR were improved with high thermal conductive SiC. SiC accelerated the rate of vulcanization reaction of SBR/BR. The crosslink density was maximized with the addition of SiC to the compound. Better heat transfer by SiC led to a reduction in the energy consumption of curing. Thermal diffusivity was raised with the addition of SiC to the compound. © 2023 Society of Plastics Engineers.
John Wiley and Sons Inc
2728397
English
Article

author Zabihi A.; Fasihi M.; Rasouli S.; Wati Sharudin R.
spellingShingle Zabihi A.; Fasihi M.; Rasouli S.; Wati Sharudin R.
Improving the mechanical properties and curing characteristics of styrene-butadiene rubber/butadiene rubber composites by incorporating silicon carbide
author_facet Zabihi A.; Fasihi M.; Rasouli S.; Wati Sharudin R.
author_sort Zabihi A.; Fasihi M.; Rasouli S.; Wati Sharudin R.
title Improving the mechanical properties and curing characteristics of styrene-butadiene rubber/butadiene rubber composites by incorporating silicon carbide
title_short Improving the mechanical properties and curing characteristics of styrene-butadiene rubber/butadiene rubber composites by incorporating silicon carbide
title_full Improving the mechanical properties and curing characteristics of styrene-butadiene rubber/butadiene rubber composites by incorporating silicon carbide
title_fullStr Improving the mechanical properties and curing characteristics of styrene-butadiene rubber/butadiene rubber composites by incorporating silicon carbide
title_full_unstemmed Improving the mechanical properties and curing characteristics of styrene-butadiene rubber/butadiene rubber composites by incorporating silicon carbide
title_sort Improving the mechanical properties and curing characteristics of styrene-butadiene rubber/butadiene rubber composites by incorporating silicon carbide
publishDate 2024
container_title Polymer Composites
container_volume 45
container_issue 2
doi_str_mv 10.1002/pc.27881
url https://www.scopus.com/inward/record.uri?eid=2-s2.0-85175522173&doi=10.1002%2fpc.27881&partnerID=40&md5=984787f8e6a19779539b29574729e7d8
description Thermal conductive filler, silicon carbide (SiC), has been investigated for its effects on the mechanical properties, microstructural properties, physical properties, and kinetic characteristics of styrene-butadiene-rubber/butadiene rubber (SBR/BR). SBR/BR-SiC's tensile strength, strain at break, and toughness were improved by 5 phr SiC content within the composite. Specifically, there was a 44% increase in tensile strength, a 51% increase in strain at break, and impressive 113% increase in toughness. Additionally, there was a notable reduction of approximately ~15% in the compression set. The calculated crosslink density using the Flory–Rehner equation proved that the SiC filler increased the covalent bonds between the polymer chains during the curing reaction. The rheometry results showed a reduction in the scorch and optimum curing times by ~10% via the incorporation of SiC. The addition of 5 phr SiC decreased the curing duration time by 47%. The scanning electron microscopy images taken from the samples at different magnifications showed that the particle agglomeration after SiC = 5 phr was the main factor in reducing the SiC performance in the composite. Highlights: Tensile properties of SBR/BR were improved with high thermal conductive SiC. SiC accelerated the rate of vulcanization reaction of SBR/BR. The crosslink density was maximized with the addition of SiC to the compound. Better heat transfer by SiC led to a reduction in the energy consumption of curing. Thermal diffusivity was raised with the addition of SiC to the compound. © 2023 Society of Plastics Engineers.
publisher John Wiley and Sons Inc
issn 2728397
language English
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