Fin Configuration Affects under Natural Convection Heat Transfer for Rectangular Fin Heatsink Using Steady-State Thermal Analysis
Heatsinks are significant to IC devices as they prevent the chip from overheating. The present study investigates different configurations of rectangular fin heat sinks. Autodesk Fusion 360 is used to design a finite element modelling-based to study the effects of different configurations of the rec...
| Published in: | 2023 IEEE Symposium on Industrial Electronics and Applications, ISIEA 2023 |
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| Main Author: | |
| Format: | Conference paper |
| Language: | English |
| Published: |
Institute of Electrical and Electronics Engineers Inc.
2023
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| Online Access: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85170084233&doi=10.1109%2fISIEA58478.2023.10212111&partnerID=40&md5=444f9a9ecf795a16ad4bff7408835c62 |