Fin Configuration Affects under Natural Convection Heat Transfer for Rectangular Fin Heatsink Using Steady-State Thermal Analysis

Fin Configuration Affects under Natural Convection Heat Transfer for Rectangular Fin Heatsink Using Steady-State Thermal Analysis

Heatsinks are significant to IC devices as they prevent the chip from overheating. The present study investigates different configurations of rectangular fin heat sinks. Autodesk Fusion 360 is used to design a finite element modelling-based to study the effects of different configurations of the rec...

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Bibliographic Details
Published in:2023 IEEE Symposium on Industrial Electronics and Applications, ISIEA 2023
Main Author: Binti Zahari N.A.; Husaini Y.B.; Binti Tuan Yaakub T.N.
Format: Conference paper
Language:English
Published: Institute of Electrical and Electronics Engineers Inc. 2023
Online Access:https://www.scopus.com/inward/record.uri?eid=2-s2.0-85170084233&doi=10.1109%2fISIEA58478.2023.10212111&partnerID=40&md5=444f9a9ecf795a16ad4bff7408835c62

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https://www.scopus.com/inward/record.uri?eid=2-s2.0-85170084233&doi=10.1109%2fISIEA58478.2023.10212111&partnerID=40&md5=444f9a9ecf795a16ad4bff7408835c62

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