Effects of Density and Resin Content on Particleboard from Oil Palm Frond (OPF)

• Published in: Springer Proceedings in Materials
• Main Author: Ahmad N.; Jalil A.M.A.; Abdullah Z.A.; Sarmin S.N.; Razali A.N.
• Format: Book chapter
• Language: English
• Published: Springer Nature 2023
• Online Access: https://www.scopus.com/inward/record.uri?eid=2-s2.0-85142885116&doi=10.1007%2f978-981-19-6195-3_4&partnerID=40&md5=825d8f4c9e593bc3bb823691f3f527f1

Oil palm frond (OPF) can act as an alternative source for wood-based industry. OPF was an agricultural waste, and it is producing millions of tons of oil palm biomass every year. The oil palm frond was obtained from oil palm plantation UiTM Pahang. The frond part of the oil palm was separated for further processes. The urea–formaldehyde (UF) resin was used as a binder. The particleboard samples were then tested for their mechanical and dimensional stability of OPF by using different resin content (8, 10, and 12%) and board density (500, 600, and 700 kgm−3). The tests on the mechanical properties include Modulus of Elasticity (MOE), Modulus of Rupture (MOR) and Internal Bonding (IB). The dimensional stability tests are thickness swelling (TS) and water absorption (WA). The results showed that the higher density board and resin content seem to have a better result in mechanical properties and dimensional stability. Statistical analysis indicated there was significant differences between boards made from different resin content except for thickness swelling (TS). The TS value exceeded the maximum set value (12%), but highly significant differences were observed in the density. Boards with a density of 700 kgm−3 and 12% of resin content achieved the minimum requirement based on the JIS A5908:2003 standard type 8 for mechanical properties. Overall, the particleboard from oil palm fronds is suitable to be used as an alternative resource to overcome the shortage of raw material in the furniture and wood industry. © 2023, The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd.