Feasibility of using low resin content levels in the production of bamboo particle composite: Basic properties

• Published in: IOP Conference Series: Earth and Environmental Science
• Main Author: Bahari S.A.; Abu F.; Zakaria M.N.; Osman S.; Appiah-Kubi E.
• Format: Conference paper
• Language: English
• Published: IOP Publishing Ltd 2021
• Online Access: https://www.scopus.com/inward/record.uri?eid=2-s2.0-85121519397&doi=10.1088%2f1755-1315%2f922%2f1%2f012005&partnerID=40&md5=73294f9fcee565283f9ee227094f203d

In this study, the suitability of Semantan bamboo (Gigantochloa scortechinii) particles in the production of single-layered composite board was investigated. The effects of different resin types and lower resin content levels on the basic properties (mechanical and physical properties) of particle composite board made from G. scortechinii were determined. The 12-mm thickness boards with dimension of 340 × 340 mm and targeted density of 660 kg/m3 were fabricated. Types of resin used were melamine urea formaldehyde (MUF) and urea formaldehyde (UF), while resin content levels were 3.5 and 5%. In general, the mechanical and physical properties of board blended with MUF resin were better than UF due to the presence of melamine in MUF that influenced the properties. Board made from 5% resin content were better in term of mechanical and physical properties than 3.5% resin content levels. 5% resin content level had increased the particles bonding ability, thus influenced the excellent properties of the board. However, in general, the properties of bamboo particle composite board in this study were not comparable to the board made from wood. Only IB properties of bamboo particle composite board exceeded the minimum requirements as stipulated in standards. As a consequence, the information of particle composite board made from bamboo is important in assessing bamboo's usefulness as an alternative raw material for wood-based industries. The final results obtained could be used as reference for researchers and manufacturers. © Published under licence by IOP Publishing Ltd.