Stagnation point flow in copper nanofluid over slippery cylinder with viscous dissipation

• Published in: Journal of Physics: Conference Series
• Main Author: Syaheera Ghazali N.M.; Abd Aziz A.S.; Soid S.K.; Ilias M.R.; Ali Z.M.
• Format: Conference paper
• Language: English
• Published: IOP Publishing Ltd 2021
• Online Access: https://www.scopus.com/inward/record.uri?eid=2-s2.0-85104207140&doi=10.1088%2f1742-6596%2f1770%2f1%2f012041&partnerID=40&md5=549eac35d0888bdb761ddbe3f154a596
• ISSN: 17426588
• DOI: 10.1088/1742-6596/1770/1/012041

This study investigates the heat transfer dissipation on stagnation point flow over a slippery stretching/shrinking cylinder in a copper nanofluid by considering the effect of viscous dissipation. A system of nonlinear partial differential equations is modelled and transformed into ordinary differential equations using similarity transformations. The governing equations with the corresponding boundary conditions are analysed numerically using a bvp4c solver in MATLAB. The solutions are found to be dependent on the Eckert number and slip parameters. The results are represented by the velocity and temperature profiles as well as the skin friction coefficient and the Nusselt number. Dual solutions are observed for the shrinking cylinder in the presence of Eckert number. Velocity profile and skin friction coefficient consistently increase while temperature profile increases initially and then decreases with the increase of slip parameter for both first and second solutions. Moreover, the presence of copper nanoparticles reduces the thermal boundary layer thickness. This research can be enhanced by using hybrid nanofluids to further improve the heat transfer. © 2021 Institute of Physics Publishing. All rights reserved.