Wireless Sensors Integration for Bend Angle and Distance Rate of Gait Measurement

This project describes the development of a gait shoe system that's capable to continuous monitoring the gait analysis by using the Internet of Things (IoT) or wireless system approach. The system consists of two bend sensors, one ultrasound sensor, Intel Edison, Minnow board, Bluetooth module,...

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Published in:Proceedings - 6th IEEE International Conference on Control System, Computing and Engineering, ICCSCE 2016
Main Author: Razak A.H.A.; Azmi M.F.; Al Junid S.A.M.; Idros M.F.M.; Halim A.K.
Format: Conference paper
Language:English
Published: Institute of Electrical and Electronics Engineers Inc. 2017
Online Access:https://www.scopus.com/inward/record.uri?eid=2-s2.0-85018958417&doi=10.1109%2fICCSCE.2016.7893637&partnerID=40&md5=ad203c68480c5e1f755083d1a635a681
id 2-s2.0-85018958417
spelling 2-s2.0-85018958417
Razak A.H.A.; Azmi M.F.; Al Junid S.A.M.; Idros M.F.M.; Halim A.K.
Wireless Sensors Integration for Bend Angle and Distance Rate of Gait Measurement
2017
Proceedings - 6th IEEE International Conference on Control System, Computing and Engineering, ICCSCE 2016


10.1109/ICCSCE.2016.7893637
https://www.scopus.com/inward/record.uri?eid=2-s2.0-85018958417&doi=10.1109%2fICCSCE.2016.7893637&partnerID=40&md5=ad203c68480c5e1f755083d1a635a681
This project describes the development of a gait shoe system that's capable to continuous monitoring the gait analysis by using the Internet of Things (IoT) or wireless system approach. The system consists of two bend sensors, one ultrasound sensor, Intel Edison, Minnow board, Bluetooth module, mobile application and a database system. Currently, gait analysis is carried out in a motion laboratory that provides a full analysis of the motion body segments using a super highly accurate computer. This method is expensive and not affordable for everyone, indeed it requires quite a lot of maintenances. Furthermore, gait analysis requires a specialist to conduct and examine the patients, which means patients have to pay a lot of visits to hospital just only to get a treatment and feedback from the doctor that resulted waste of time, energy and money. Thus, this project will introduce a new and advance ways solution in order to evaluate the gait parameters. In this project, it will focus on two types of gait parameters, which is plantar flexion and dorsiflexion. One of the bend sensors is intended to be place under the sole and another one is around the ankle. The ultrasound sensor it will be assembled at the side of the shoe. The advantages of the completed system are when both of these sensors recorded all the gait information the subject or the patient still can do the daily routine life without interruption. The designed gait shoe is also able to display results from the analysis and sent it directly to the medical specialist through database to the data center analysis or online monitoring and at the same time the patient also can monitor via mobile phone. © 2016 IEEE.
Institute of Electrical and Electronics Engineers Inc.

English
Conference paper

author Razak A.H.A.; Azmi M.F.; Al Junid S.A.M.; Idros M.F.M.; Halim A.K.
spellingShingle Razak A.H.A.; Azmi M.F.; Al Junid S.A.M.; Idros M.F.M.; Halim A.K.
Wireless Sensors Integration for Bend Angle and Distance Rate of Gait Measurement
author_facet Razak A.H.A.; Azmi M.F.; Al Junid S.A.M.; Idros M.F.M.; Halim A.K.
author_sort Razak A.H.A.; Azmi M.F.; Al Junid S.A.M.; Idros M.F.M.; Halim A.K.
title Wireless Sensors Integration for Bend Angle and Distance Rate of Gait Measurement
title_short Wireless Sensors Integration for Bend Angle and Distance Rate of Gait Measurement
title_full Wireless Sensors Integration for Bend Angle and Distance Rate of Gait Measurement
title_fullStr Wireless Sensors Integration for Bend Angle and Distance Rate of Gait Measurement
title_full_unstemmed Wireless Sensors Integration for Bend Angle and Distance Rate of Gait Measurement
title_sort Wireless Sensors Integration for Bend Angle and Distance Rate of Gait Measurement
publishDate 2017
container_title Proceedings - 6th IEEE International Conference on Control System, Computing and Engineering, ICCSCE 2016
container_volume
container_issue
doi_str_mv 10.1109/ICCSCE.2016.7893637
url https://www.scopus.com/inward/record.uri?eid=2-s2.0-85018958417&doi=10.1109%2fICCSCE.2016.7893637&partnerID=40&md5=ad203c68480c5e1f755083d1a635a681
description This project describes the development of a gait shoe system that's capable to continuous monitoring the gait analysis by using the Internet of Things (IoT) or wireless system approach. The system consists of two bend sensors, one ultrasound sensor, Intel Edison, Minnow board, Bluetooth module, mobile application and a database system. Currently, gait analysis is carried out in a motion laboratory that provides a full analysis of the motion body segments using a super highly accurate computer. This method is expensive and not affordable for everyone, indeed it requires quite a lot of maintenances. Furthermore, gait analysis requires a specialist to conduct and examine the patients, which means patients have to pay a lot of visits to hospital just only to get a treatment and feedback from the doctor that resulted waste of time, energy and money. Thus, this project will introduce a new and advance ways solution in order to evaluate the gait parameters. In this project, it will focus on two types of gait parameters, which is plantar flexion and dorsiflexion. One of the bend sensors is intended to be place under the sole and another one is around the ankle. The ultrasound sensor it will be assembled at the side of the shoe. The advantages of the completed system are when both of these sensors recorded all the gait information the subject or the patient still can do the daily routine life without interruption. The designed gait shoe is also able to display results from the analysis and sent it directly to the medical specialist through database to the data center analysis or online monitoring and at the same time the patient also can monitor via mobile phone. © 2016 IEEE.
publisher Institute of Electrical and Electronics Engineers Inc.
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language English
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