Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)

This paper presents the thermal management of electronic components, microprocessor by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of microprocessors is built using GAMBIT and simulated using FLUENT software. The study was made for four microprocessors arr...

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Bibliographic Details
Published in:Advanced Materials Research
Main Author: Mazlan M.; Rahim A.; Mustafa Al Bakri A.M.; Razak W.; Zubair A.F.; Najib Y.M.; Azman Bakir A.
Format: Conference paper
Language:English
Published: 2013
Online Access:https://www.scopus.com/inward/record.uri?eid=2-s2.0-84886258204&doi=10.4028%2fwww.scientific.net%2fAMR.795.141&partnerID=40&md5=dd92f43392e68cd5354de8ee2a800e6b

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