Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)
This paper presents the thermal management of electronic components, microprocessor by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of microprocessors is built using GAMBIT and simulated using FLUENT software. The study was made for four microprocessors arr...
| Published in: | Advanced Materials Research |
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| Main Author: | |
| Format: | Conference paper |
| Language: | English |
| Published: |
2013
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| Online Access: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84886258204&doi=10.4028%2fwww.scientific.net%2fAMR.795.141&partnerID=40&md5=dd92f43392e68cd5354de8ee2a800e6b |