Thermal management of electronic components by using computational fluid dynamic (CFD) software, fluent™ in several material applications (epoxy, composite material & nano-silver)

• Published in: Advanced Materials Research
• Main Author: Mazlan M.; Rahim A.; Mustafa Al Bakri A.M.; Razak W.; Zubair A.F.; Najib Y.M.; Azman Bakir A.
• Format: Conference paper
• Language: English
• Published: 2013
• Online Access: https://www.scopus.com/inward/record.uri?eid=2-s2.0-84886258204&doi=10.4028%2fwww.scientific.net%2fAMR.795.141&partnerID=40&md5=dd92f43392e68cd5354de8ee2a800e6b

This paper presents the thermal management of electronic components, microprocessor by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of microprocessors is built using GAMBIT and simulated using FLUENT software. The study was made for four microprocessors arranged in line under different types of materials, inlet velocities and package (chip) powers. The results are presented in terms of averagejunction temperature and thermal resistance of each package Thejunction temperature is been observed and it was found that the junction temperature of the microprocessors is not exceed 70° C. It also found that the (chip) powers and inlet velocities are the most important elements to control and manage the junction temperature. The strength of CFD software in handling heat transfer problems is proved to be excellent. © (2013)Trans Tech Publications, Switzerland.