Microstructure evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu system lead free solder under long term thermal aging

Due to environmental concerns, lead-free solders were introduced in replacing the leadbased solders in microelectronics devices technology. Although there are many lead-free solder available, the Sn-Ag-Cu solder was considered the best choice. But the solder has its draw backs in terms of melting te...

Full description

Bibliographic Details
Published in:Advanced Materials Research
Main Author: Ghani N.A.A.; Yahya I.; Salleh M.A.A.M.; Shamsuddin S.; Ahmad Z.A.; Mayappan R.
Format: Conference paper
Language:English
Published: 2013
Online Access:https://www.scopus.com/inward/record.uri?eid=2-s2.0-84871887552&doi=10.4028%2fwww.scientific.net%2fAMR.620.263&partnerID=40&md5=e98ac1448df1e2fd14526a721544e45a

Similar Items