Microstructure evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu system lead free solder under long term thermal aging
Due to environmental concerns, lead-free solders were introduced in replacing the leadbased solders in microelectronics devices technology. Although there are many lead-free solder available, the Sn-Ag-Cu solder was considered the best choice. But the solder has its draw backs in terms of melting te...
Published in: | Advanced Materials Research |
---|---|
Main Author: | Ghani N.A.A.; Yahya I.; Salleh M.A.A.M.; Shamsuddin S.; Ahmad Z.A.; Mayappan R. |
Format: | Conference paper |
Language: | English |
Published: |
2013
|
Online Access: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84871887552&doi=10.4028%2fwww.scientific.net%2fAMR.620.263&partnerID=40&md5=e98ac1448df1e2fd14526a721544e45a |
Similar Items
-
Intermetallic evolution of Sn-3.5Ag-1.0Cu-0.1Zn/Cu interface under thermal aging
by: Yahya I.; Ghani N.A.A.; Abiddin N.N.Z.; Hamidi A.H.; Mayappan R.
Published: (2013) -
Effect of TiO2 nanoparticles on the horizontal hardness properties of Sn-3.0Ag-0.5Cu-1.0TiO2 composite solder
by: Mohd Nasir S.S.; Yahaya M.Z.; Erer A.M.; Illés B.; Mohamad A.A.
Published: (2019) -
Prediction of the 96.5Sn-3.0Ag-0.5Cu Stress–Strain Curves Using Artificial Neural Network
by: Yamin A.F.M.; Mahmud J.; Abdullah A.S.; Manan N.F.A.
Published: (2024) -
Phase formation and critical temperature of (Tl0.5Pb0.5)Sr2Ca(Cu2-xCrx)O7-δ (x = 0 - 0.100) superconductor; [Pembentukan Fasa dan Suhu Genting Superkonduktor (Tl0.5Pb0.5)Sr2Ca(Cu2-xCrx)O7-δ (x = 0 - 0.100)]
by: YuSrianto E.; Jannah A.N.; Abd-Shukor R.
Published: (2021) -
Microstructure Evolution and Shear Strength Study of Sn–9Zn and Sn–8Zn–3Bi on Cu Substrate
by: Mayappan R.; Ahmad Z.A.
Published: (2024)