Intermetallic evolution of Sn-3.5Ag-1.0Cu-0.1Zn/Cu interface under thermal aging
Due to environmental concerns, lead-free solders were introduced in replacing the leadbased solders in microelectronics devices technology. Although there are many lead-free solder available, the Sn-Ag-Cu is considered the best choice. But the solder has its draw backs in terms of melting temperatur...
| Published in: | Advanced Materials Research |
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| Main Author: | |
| Format: | Conference paper |
| Language: | English |
| Published: |
2013
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| Online Access: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-84871861957&doi=10.4028%2fwww.scientific.net%2fAMR.620.142&partnerID=40&md5=42b0524616d586a996592cebc941a393 |