APA引文

D, A. Z. A. M. S. (2010). Fracture toughness of thixotropic and room temperature cured epoxy-based adhesives for in situ timber bonding. International Journal of Adhesion and Adhesives, 30(7), . https://doi.org/10.1016/j.ijadhadh.2010.05.005

Chicago Style (17th ed.) Citation

D, Ahmad Z.; Ansell M.; Smedley. "Fracture Toughness of Thixotropic and Room Temperature Cured Epoxy-based Adhesives for in Situ Timber Bonding." International Journal of Adhesion and Adhesives 30, no. 7 (2010). https://doi.org/10.1016/j.ijadhadh.2010.05.005.

MLA引文

D, Ahmad Z.; Ansell M.; Smedley. "Fracture Toughness of Thixotropic and Room Temperature Cured Epoxy-based Adhesives for in Situ Timber Bonding." International Journal of Adhesion and Adhesives, vol. 30, no. 7, 2010, https://doi.org/10.1016/j.ijadhadh.2010.05.005.